Avaliable Range of Epi Services
• Double-side polished epi
Available Size
• 100mm-200mm
Application
• Power Semiconductor
• MEMS
• Discrete devices
• Integrated circuits
• Analog devices
• Electrical Sensors
• RF Devices
Thick EpiOur thick epi is especially suitable for discrete power devices, such as IGBTs, FREDs, HV MOSFETs, and high-voltage Zener diodes. Our tight thickness and resistivity control and great uniformity for even very thick epi layers results in high yield and excellent device performance.
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Epi for Sensor Applications
One of our specialties is epi for sensor applications, specifically epi on double-side polished (DSP) silicon wafers. Our extensive knowledge of DSP wafer and the DSP epi process allows us to use a proprietary process that results in great epi layer uniformity for best device performance and allows bonding on the backside of the wafer.